"PhySim-MuLan" is a brand under PhySim Electronic Technology Co., Ltd.

Founded in 2019, the company is dedicated to the research and development of Electronic Design Automation (EDA) multi-physics simulation software and technology. Widely adopted by engineers in the fields of electronic system design and intelligent manufacturing, PhySim-MuLan focuses on providing open, flexible solutions that enable direct simulation of designs.They have developed a comprehensive service platform that covers the entire process from design and simulation to testing and delivery, emphasizing rapid, efficient, and cost-conscious product development. In addition, the company actively nurtures channel partners to provide integrated services for sales, training, and technical support to customers.

Headquartered in Shanghai, PhySim-MuLan has research and development centers in Shenzhen, Chengdu, Xi'an, Singapore, and Silicon Valley. With nearly a hundred employees, 70% of whom are research and development personnel, the company has assembled a team of industry experts with over 40 years of experience, where the core team members have an average of nearly thirty years in the industry. The research and development team comprises over 70% of individuals with master's degrees, including more than twenty doctoral and postdoctoral researchers, laying a solid foundation for the company's independent research and technological advancement.

In 2021, the company completed industrial integration by acquiring Shenzhen Zhongke System Integration Technology Co., Ltd., which had been deeply involved in advanced packaging for over a decade, accumulating a wealth of experience in advanced packaging processes. This acquisition positioned PhySim-MuLan as the only domestic service provider offering a full-stack solution from advanced packaging design, multi-physics field simulation to product realization. Their product line includes:

- Electromagnetic simulation, covering chip packaging, PCB, and system-level signal integrity, power integrity, EMI/EMC, antenna simulation, and more.

- Thermal/electrothermal and thermal stress simulation, encompassing analysis of heat transfer, electrothermal properties, and thermal stress at the chip packaging, PCB, and system levels.

- Chip module design based on advanced packaging.

These products find wide applications in various industries such as aerospace, electronics, automotive, maritime, communications, electronics, and healthcare.