PhySim Electronic Technology Co., Ltd.
中文 / English
测试板设计能力
| Item | ATE model | ATE Tester Vendor |
|---|---|---|
| 1 | V93K Half / Full WPI / Load Board / Probe Card | Advantest |
| 2 | T6575 | Advantest |
| 3 | T5830 Probe Card | Advantest |
| 4 | J750 / J750HD / EX Load Board | Teradyne |
| 5 | J750 Probe Card 12inch | Teradyne |
| 6 | Catalyst | Teradyne |
| 7 | IFIEX / UFIEX | Teradyne |
| 8 | M2 Probe Card | LTX-CREDENCE |
| 9 | D10 / DX Load Board | LTX-CREDENCE |
| 10 | ASL 1000 | LTX-CREDENCE |
| 11 | 3360 / 3380 | Chroma |
| 12 | AF8862 / AF8652 | Ando/DI |
| 13 | Other BlB tester Type | Other |
Capacity
Design：
15-20 Cases per month
PCB Fab：
Have enough capacity
SMT Assembly：
Have enough capacity
Cycle Time
Design：
7-30 Calendar days per case
PCB Fab：
10-30 Calendar days per case
SMT Assembly：
2-5 Calendar days per case
测试板加工能力1
| Item | Standard | Advanced | |
|---|---|---|---|
| Bow & Twist Tolerance | Load Board | 0.5% | 0.4% |
| Probe Card | 0.3% | 0.2% | |
| Lamination Registration | One Lamination | 4mil | 2.5mil |
| N + M Lamination | 6mil | 4mil | |
| Impedance Tolerance | Inner Layer | +/-10% | +/-5% |
| Outter layer | +/-10% | +/-7% | |
| ATE Material | FR4 | EM827，370HR，S1000-2，IT180A，T158，TU862HF | |
| High Speed | Megtron6，Megtron4，Megtron7，TU872SLK，FR408HR，N400013 Series，MW4000，MW2000 | ||
| High Frequency | Ro3003，Ro3006，RO4350B，RO4360G2，Ro4835 | ||
| BIB Material | Polyimide（135 to 180 ° C） | Arlon 85N，33N / Shengyi SH260 | |
| HighTg FR4（up to 135 ° C） | EM827，S1000-2，IT180A，370HR | ||
| Surface Finish | Common | HASL，ENIG，Immersion Tin，OSP，Immersion Silver，ENEPIG | |
| Electroplating Gold |
Hard Gold，Gold Finger，Encap + ENIG，
Hard Gold，ENIG，Hard Gold + Encap + ENIG |
||
测试板加工能力2
| Item | Standard | Advanced | |
|---|---|---|---|
| BAG Pitch | PTH | 0.40mm | 0.35mm |
| HDI | 0.35mm | 0.30mm | |
| Min. Hole Size | Drill | 0.13mm | 0.10mm |
| Laser | 0.10mm | 0.075mm | |
| Stacked Via Count | 2 | 5 | |
| Aspect Ratio | Drill：0.15mm | 33 | 40 |
| Drill：0.13mm | 30 | 40 | |
| Drill：0.10mm | 10 | 20 | |
| Min. Line | Inner Layer HOZ | 2.0/2.5mil | 1.5/2.5mil |
| Inner Layer HOZ | 2.8/2.8mil | 2.5/2.5mil | |
| Outer Layer HOZ | 2.8/2.8mil | 2.2/2.5mil | |
| Outer Layer HOZ | 2.8/3.2mil | 2.8/3.0mil | |
| Layer | 2-64L | 100L | |
| Max. Board Thickness | 6.3mm（250mil） | 7.5mm（300mil） | |
| Thickness（≥4mm）Tolerance | +/-0.30mm | +/-0.20mm | |
测试板部分案例
案例1
| Model Type | V93K Full Size |
|---|---|
| Thickness/mm | 6.35 |
| DUT counts | 4 |
| Min parts | 0201 |
| Important skill | SMT RF relay |
| Model Type | T6575 Load Board |
|---|---|
| Thickness/mm | 6.35 |
| DUT counts | 4 |
| Min parts | 0201 |
| Important skill | One stop service |
案例2
| Model Type | SLT Board |
|---|---|
| Thickness/mm | 1.6 |
| DUT counts | 1 |
| Min parts | 0402 |
| Important skill | One stop service |
| Model Type | O/S Test Board |
|---|---|
| Thickness/mm | 4.3 |
| DUT counts | 4 |
| Min parts | Hon.tech O/S TESTER |
| Important skill | One stop service |
| Model Type | DDR3 BIB |
|---|---|
| Thickness/mm | 1.6 |
| DUT counts | 1 |
| Min parts | 0402 |
| Important skill | One stop service |
